Silicon is used in the making of semiconductors. Silicon grinding is the process whereby the material is shaped and molded so it can be made into all sorts of things like integrated circuits, as well as memory that goes into computers. So, as you can imagine, computer production companies rely heavily on this process, and, as computers have taken off in sales, so have the crystal wafers made of silicon. Manufacturers are always looking at ways to streamline the process to produce a higher quality product at a faster rate of production.
Many semiconductor devices are made from silicon. In the past, such things as random access memory had also been made of the material, alongside transistors. Bell Telephone Labs are supposed to have first came out with the term 'transistor' during the 1940s and the term has stuck ever since.
As an indication as to how crucial silicon is in the making of semiconductor devices, more than 90% of them are made up of crystal silicone wafers. To further amplify this, it should be borne in mind that around one hundred and fifty million of the wafers are made annually. Therefore, quality and quantity of supplies is very important.
During the process the crystal is first sliced and then flattened, and this is referred to as grinding or lapping. Afterwards it's polished and etched and is usually ready to use. By doing this the maker hopes to eliminate the little cracks that can be appear not only on the surface of the material, but in the subsurface. To do this a diamond wheel is rotated towards a piece of the wafer, which is also spinning, but remains in place, ready as the wheel collides with it and molds it.
Cracks in the material are not a good thing and are often lamented by the grinder. In fact, a large portion of the silicon is actually removed during the grind process, to remove the surface cracks. One way of preventing the loss of so much silicone could be to use smaller diamond grains, these are the materials which contact the wafer's surface. It's been tested previously, with results some find encouraging.
Other techniques that can be used are what is called the electrolytic in-process dressing or ELID. The way it works is by continuously using smaller sizes of diamond to grind the wafers. It uses a technique called self-dressing, which simply means that the grinding wheel releases worn diamond grains and exposes the newer grains as part of a natural process, meaning without any outside interference.
Overall, some believe the use of a much smaller diamond grain is the answer to more efficient grinding. They advocate ELID because in the traditional process it's hard to use the much smaller grains that are used in the ELID process.
Silicon grinding has undergone changes throughout the years and one thing makers are looking for are ways to improve production. It may, however, be some time before ELID is used, simply because the quality is reportedly not as consistent as the conventional methods.
Many semiconductor devices are made from silicon. In the past, such things as random access memory had also been made of the material, alongside transistors. Bell Telephone Labs are supposed to have first came out with the term 'transistor' during the 1940s and the term has stuck ever since.
As an indication as to how crucial silicon is in the making of semiconductor devices, more than 90% of them are made up of crystal silicone wafers. To further amplify this, it should be borne in mind that around one hundred and fifty million of the wafers are made annually. Therefore, quality and quantity of supplies is very important.
During the process the crystal is first sliced and then flattened, and this is referred to as grinding or lapping. Afterwards it's polished and etched and is usually ready to use. By doing this the maker hopes to eliminate the little cracks that can be appear not only on the surface of the material, but in the subsurface. To do this a diamond wheel is rotated towards a piece of the wafer, which is also spinning, but remains in place, ready as the wheel collides with it and molds it.
Cracks in the material are not a good thing and are often lamented by the grinder. In fact, a large portion of the silicon is actually removed during the grind process, to remove the surface cracks. One way of preventing the loss of so much silicone could be to use smaller diamond grains, these are the materials which contact the wafer's surface. It's been tested previously, with results some find encouraging.
Other techniques that can be used are what is called the electrolytic in-process dressing or ELID. The way it works is by continuously using smaller sizes of diamond to grind the wafers. It uses a technique called self-dressing, which simply means that the grinding wheel releases worn diamond grains and exposes the newer grains as part of a natural process, meaning without any outside interference.
Overall, some believe the use of a much smaller diamond grain is the answer to more efficient grinding. They advocate ELID because in the traditional process it's hard to use the much smaller grains that are used in the ELID process.
Silicon grinding has undergone changes throughout the years and one thing makers are looking for are ways to improve production. It may, however, be some time before ELID is used, simply because the quality is reportedly not as consistent as the conventional methods.
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